Built-in 1 testing module, it supports Qualcomm, MTK, Hisilicon and Unisoc chipset module, it can be connected to PC via USB cable.
2 independent compartments, built-in fans for heat dissipation in each compartment. Fit in 19-inch rack. Each compartment can put in 1 SU or 1 testing phone. Both can be connected to PC via USB cable.
4 independent compartments, built-in fans for heat dissipation in each compartment. Each compartment can put in 1 SU or 1 testing phone. Built-in X86 host PC. It can be tested the module or phone with the internal connection.
